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| Gunter Semiconductor GmbH Chip Specification General Description: * Advanced Process Technology * Dynamic dV/dt Rating * 175 Operating Temperature * Fast Switching * Fully Avalanche Rated *Extremely low RDS(ON) Mechanical Data: D27 6.53mm x6.53mm Dimension 400 m Thickness: Metallization: Al Top : : CrNiAg / Au Backside : Suggested Bonding Conditions: Die Mounting: Solder Perform 95/5 PbSn or 92.5./2.5/5 PbAgIn 20 mil Al Source Bonding Wire: Absolute Maximum Rating Characteristics Drain-to-Source Breakdown Voltage Static Drain-to - Source On-resistance Continuous Drain current ( in target package) Continuous Drain current ( in target package) Operation Junction Storage Temperature @Ta=25 GFC150 N Channel Power MOSFET with extremely low RDS(ON) Symbol V(BR)DSS RDS(ON) ID@25 ID@100 Tj Limit Unit Test Conditions VGS=0V, ID=250 VGS=10V, ID=25 VGS=10V VGS=10V 100 0.055 41 29 -55~175 -55~175 V A A TSTR Target Device: IRFP150 TO-247AC PD 230 W @Tc=25 |
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